
In SMT production, printing, placement and soldering are the three core processes; according to authoritative statistics, nearly 60% of SMT defections are related to the printing process; the viscosity state of solder paste directly affects its printing quality. Therefore, precise control of the viscosity of solder paste and printing parameters is crucial to ensure the correct placement of electronic components and the quality of the final product.
Industry-related literature reference:
——IPC-7525B < Stencil Design Guidelines > and related SMT process guidelines
—— < Analysis and Treatment Methods for Poor Solder Paste Printing Forming in SMT Manufacturing > 2025 Edition
—— SEMI ( Semiconductor Equipment and Materials International ) related technical documents
—— 'Research on Quality Improvement of SMT Process' Industry White Paper
Common Printing Defects
SMT industry common defections caused by solder paste viscosity
Insufficient Solder Paste |
Voids |
Solder ball |
Cold solder joint |
Excess solder paste |
Misalignment |
Solder bridge |
Tombstone |
Multi -Scenario Process Adaption
Covers SMT assembly, SIP packaging, and automotive electronics manufacturing.Addresses bridging risks In high-temperature (>26C) environments and poor demolding Issues Iin low-temperature(< 18C)environments, achieving coordinated improvement Inprinting-reflow soldering quality.
Especlally essential products for solder paste printing machines
Summary: Suitable for all equipment requiring temperature and humidity control
Personal MES docking (Can Develop the MEs system according to yourrequirement)
Printing environment | Solder paste status | Printing risk |
High temperature + low humidity | Viscosity drops sharply + The solvent evaporates quickly. → Early thin, late dry | Edge collapse →solder bridge; miss print |
High temperature + high humidity | low viscosity + May absorb moisture | Solder bridge 、solder ball |
low temperature + low humidity | high viscosity + Easier to dry | Incomplete printing、voids |
low temperature + high humidity | high viscosity + Moisture absorption risk | Demolding defect、soldering open |
23±3℃+ 50±10%RH | viscosity stability、Good fluidity | The printing is clear、Complete molding |
The viscosity of solder paste is a core parameter affecting printing performance, and its control precision is directly related to printing quality. As a key equipment for regulating the SMT printing environment, the constant temperature and humidity intelligent control machine accurately controls the temperature and humidity conditions of the solder paste printing environment through dual technologies of refrigeration and humidification. This equipment can stabilize the temperature and humidity during the printing process within the range required by the process, effectively avoiding abnormal viscosity of solder paste caused by environmental fluctuations, thereby comprehensively improving the printing quality throughout the entire SMT manufacturing process.
Smart Temperature and Humidity Control Machine
![]() | Temperature and humidity bidirectional control technology, precisely regulating the temperatureand humidity environment of solder paste printers. Effectively prevents viscosity abnormalitiesin solder paste caused by environmental fluctuations, comprehensively improving the qualityof the entire SMT printing manufacturing process. |
Power supply and power | 220V/50HZ,3.8KW |
Cooling capacity | 2.7KW |
Compressor power | 750W |
Wind volume | 400M³/H |
Heater power | 2KW |
Temperature adjustment range | 20℃-26℃ |
Water scarcity protection | have(Water shortage alarm) |
Water level control | have(microcomputer control) |
Power protection | have(Overload protection) |
Control method | PLC Automatic control |
Air circulation method | Side suction, Top air supply |
Cooling current | 14.5A |
Compressor | Panasonic |
Refrigerant | R410 |
Wind turbine power | 130W |
Humidifier quantity | 1-1.5kg/h |
Humidity adjustment range | 40-60% |
Cold air duct | 1200MM |
Condensate protection | Have(Water level alarm) |
Condensate water treatment method | 15L water storage bucket |
Temperature and humidity display | color LCD touch screen |
Device dimensions(L*W*H) | 860*535*1100 |
Viscosity precision control Through the intelligent temperature and humidity control system, the printing environment is precisely maintained within the range of 20-26℃±1℃ and 40-60%RH±5%, effectively stabilizing the rheological properties of solder paste. |
Non-performing ratio drops by over 30% Avoid the issue of "high temperature and low humidity → sharp drop in solder paste viscosity → printing bridging", reduce stencil clogging, accumulation, stringing, and defects, decrease wiping frequency, lower the risk of cold soldering/poor solder joints. Testing shows a direct 30% drop in solder paste printing defect rates. |
Intelligent control system Real-time monitoring and regulation of environmental temperature, humidity, and solder paste viscosity, dynamically optimizing printing parameters, supporting MES and other system integrations, and enabling full-process data traceability. |
Multi-brand adaptation compatibility Modular design compatible with mainstream SMT printers such as MPM, DEK, and GKG, suitable for temperature and humidity control in luid equipment, ready-to-use upon connection, no modification required, easy to operate, and low maintenance cost. |
Rapid Response and Energy Efficiency Rapidly adjusts temperature and humidity through cooling and humidification, shortening startup time, reducing solder paste waste and solvent evaporation, in line with green manufacturing trends. |
Dual Improvement in Quality and Production Stabilizes viscosity activity, lowers defectrates, and improves yield and output. Forms a quality optimization closed loop of environmental control - quality monitoring - data traceability achieving dualbreakthroughs in efficiency and quality. |
Electronics manufacturing industry |
Semiconductor packaging industry |
Electronics repair industry |
Scientific research and education industry |
Q: Do you have your own factory?
Yes, we have factories in Jiangsu and Shenzhen, China. Welcome to visit our company and factories. We are a professional manufacturer of intelligent solder paste cabinets, providing OEM services for customers.
Q: When will the goods be delivered?
For customized products,delivery is usually around 30 days. Personal MES docking.
Q: How can we guarantee quality?
9 Years of focus on intelligent solder paste cabinet. Always final Inspection before shipment; Support remote installation and debugging
Q: What can you buy from us?
Intelligent solder paste cabinet precise temperature and humidity control machine A good companion for solder paste printing machines automatically online contactless Inkjet printer and automatically Labeling machine
Q: Why should you buy from us not from other suppliers?
1.China first manufacturer for intelligent solder paste cabinet in China with 9 years experience
2.Over 30 countries global users and 50% market share , over 100 of the Top 500 enterprises in china are now our clients.
3.Professional after sales services for whole life technical support.